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tcad-devsim_triac/device_config.py
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# device_config.py
# All units in cm (1 um = 1e-4 cm)
um = 1e-4
# --- Geometric Dimensions ---
W_DEVICE = 356.0 * um # Half-width of the device (356 x 2 total width)
H_SI = 200.0 * um # Silicon substrate thickness
T_OX = 2.0 * um # Oxide thickness
H_MOLD = 100.0 * um # Molding compound thickness (above oxide)
W_SIDE_MOLD = 100.0 * um # Molding compound width on the sides
W_SIM = W_DEVICE + W_SIDE_MOLD # Half-width of the total simulation domain
# --- P-well parameters (p11, p12, p13) ---
P_WELL_DEPTH = 5.0 * um # 5 um depth for all P-wells
# P-well X boundaries (Right half, will be mirrored for left half)
P11_X1 = 75.0 * um
P11_X2 = 100.0 * um
P12_X1 = 120.0 * um
P12_X2 = 130.0 * um
P13_X1 = 150.0 * um
P13_X2 = 255.0 * um
# --- N+ region parameters ---
NPLUS_DEPTH = 1.0 * um # 1 um depth for all N+ regions
# N+ X boundaries (Right half, mirrored for left half)
NPLUS_X1 = 164.0 * um
NPLUS_X2 = 185.0 * um
# MRING X boundaries (Right half, mirrored for left half)
MRING_X1 = 340.0 * um
MRING_X2 = 356.0 * um
# --- Doping Concentrations (cm^-3) ---
N_SUB = 1.0e16
P11_PEAK = 1.0e18
P12_PEAK = 1.0e17
P13_PEAK = 1.0e18
NPLUS_PEAK = 1.0e19
# --- Doping Gradient / Diffusion Widths ---
# P-well gradient widths
P_WELL_VDDIFF = 5.0 * um # Vertical gradient width (characteristic depth)
P_WELL_HDDIFF = 3.0 * um # Horizontal (lateral) gradient width
# N+ gradient widths
NPLUS_VDDIFF = 1.0 * um # Vertical gradient width
NPLUS_HDDIFF = 0.6 * um # Horizontal (lateral) gradient width
# --- Contact Vias Width and Positions (Right half, mirrored for left) ---
VIA_WIDTH = 10.0 * um
# Contact via center positions
VIA_P11_X = 87.5 * um
VIA_P13_X = 174.5 * um
# --- Metal Field Plate X boundaries (Right half, mirrored for left) ---
MT1_FP1_X1 = 30.0 * um
MT1_FP1_X2 = 186.0 * um
MT1_FP2_X1 = 250.0 * um
MT1_FP2_X2 = 295.0 * um